| 摘要 |
A plurality of modules is densely arranged in a small space, and degradation of high-speed digital signals transmitted between these modules is suppressed. A chassis to which a power cable and an optical signal cable are drawn is provided, and a plurality of first modules which are mounted on the chassis and which are connected to the power cable and the optical signal cable are provided. Each first module includes: a first metal package; a first package substrate accommodated in the first metal package and thermally connected to the first metal package; and a first semiconductor chip equipped on the first package substrate, and the chassis and the first metal package included in each first module are thermally connected to each other. |
