发明名称 PROCESS MAPPING OF COOLING RATES AND THERMAL GRADIENTS
摘要 A method performed by one or more processing devices includes conducting a plurality of tests of a manufacturing process. Each test is conducted at a different combination of at least a first process variable and a second process variable, and each test comprises locally heating a region of a structure, where the local heating results in formation of a thermal field in the structure, and assessing a temperature derivative of the thermal field. Based on results of the plurality of tests, a process map of the temperature derivative of the thermal field is generated, with the temperature derivative based on a function of the first process variable and the second process variable.
申请公布号 US2015219572(A1) 申请公布日期 2015.08.06
申请号 US201314422092 申请日期 2013.08.16
申请人 Carnegie Mellon University ;Wright State University 发明人 Beuth, JR. Jack Lee;Klingbeil Nathan W.;Gockel Joy Davis
分类号 G01N25/00 主分类号 G01N25/00
代理机构 代理人
主权项 1. A method performed by one or more processing devices, the method comprising: conducting a plurality of tests of a manufacturing process, each test conducted at a different combination of at least a first process variable and a second process variable, each test comprising: locally heating a region of a structure, wherein the local heating results in formation of a thermal field in the structure, andassessing a temperature derivative of the thermal field; and based on results of the plurality of tests, generating a process map of the temperature derivative of the thermal field, with the temperature derivative based on a function of the first process variable and the second process variable.
地址 Pittsburgh PA US