发明名称 |
PROCESS MAPPING OF COOLING RATES AND THERMAL GRADIENTS |
摘要 |
A method performed by one or more processing devices includes conducting a plurality of tests of a manufacturing process. Each test is conducted at a different combination of at least a first process variable and a second process variable, and each test comprises locally heating a region of a structure, where the local heating results in formation of a thermal field in the structure, and assessing a temperature derivative of the thermal field. Based on results of the plurality of tests, a process map of the temperature derivative of the thermal field is generated, with the temperature derivative based on a function of the first process variable and the second process variable. |
申请公布号 |
US2015219572(A1) |
申请公布日期 |
2015.08.06 |
申请号 |
US201314422092 |
申请日期 |
2013.08.16 |
申请人 |
Carnegie Mellon University ;Wright State University |
发明人 |
Beuth, JR. Jack Lee;Klingbeil Nathan W.;Gockel Joy Davis |
分类号 |
G01N25/00 |
主分类号 |
G01N25/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method performed by one or more processing devices, the method comprising:
conducting a plurality of tests of a manufacturing process, each test conducted at a different combination of at least a first process variable and a second process variable, each test comprising:
locally heating a region of a structure, wherein the local heating results in formation of a thermal field in the structure, andassessing a temperature derivative of the thermal field; and based on results of the plurality of tests, generating a process map of the temperature derivative of the thermal field, with the temperature derivative based on a function of the first process variable and the second process variable. |
地址 |
Pittsburgh PA US |