| 摘要 |
<p>It is related to an apparatus and a method for manufacturing a semiconductor package. A retainer (24) for retaining a wafer (20) is disclosed. The wafer (20) having a top surface for forming an integrated circuit (IC) thereon and a bottom surface opposite to the top surface. The retainer (24) comprises an opening, a base portion (240) around the opening, and a positioning portion (242) connecting with the base portion. The base portion (240) is configured to support the bottom surface of the wafer, the positioning portion (242) is configured to transversely position the wafer (20), and the opening is configured to expose the bottom surface corresponding the valid area of the wafer. The method involves applying a flattening element (22) on the positioning portion (242) above the wafer (20) to flatten the wafer in an alloy process.</p> |
