发明名称 SUBSTRATE PROCESSING SYSTEM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
摘要 PROBLEM TO BE SOLVED: To improve characteristics of a film formed on a substrate and to improve a manufacture throughput.SOLUTION: A substrate processing apparatus has: a plurality of processing chambers in which substrates are stored; a processing gas supply system which supplies a processing gas to the processing chambers in order; a reaction gas supply system which supplies an activated reaction gas to the processing chambers in order; a buffer tank which is provided for the processing gas supply system; and a control part which controls the processing gas supply system and reaction gas supply system to supply the processing gas and reaction gas alternately to the respective processing chambers so that a time for which the reaction gas is supplied to one of the processing chambers is equal to the total of a time for which the processing gas is supplied to one of the processing chambers and a time for which the processing gas is supplied to the buffer tank.
申请公布号 JP2015143383(A) 申请公布日期 2015.08.06
申请号 JP20140040430 申请日期 2014.03.03
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 SATO TAKETOSHI
分类号 C23C16/455;H01L21/31;H01L21/316;H01L21/318 主分类号 C23C16/455
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