PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, MASK MATERIAL FOR SAND BLASTING, AND SURFACE PROCESSING METHOD OF PROCESS OBJECT

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having such properties that a support body can be easily stripped from a photosensitive layer of the composition without disposing a release layer and that a resist pattern having excellent adhesiveness and resolution can be formed on a substrate such as a glass substrate, and a photosensitive element, a surface processing method of a process object, and a mask material for sand blasting using the above resin composition.SOLUTION: The photosensitive resin composition comprises: (A) a binder polymer having a carboxyl group; (B) a photopolymerizable compound having an ethylenically unsaturated group; (C) a photopolymerization initiator; (D) a plasticizer containing phosphorus; and (E) a silane compound. The (B) photopolymerizable compound having an ethylenically unsaturated group comprises a urethane (meth)acrylate compound.