发明名称 PIEZOELECTRIC DEVICE PACKAGE AND PIEZOELECTRIC DEVICE
摘要 In the present invention, when installing a piezoelectric oscillation piece in a main package body, the spread of adhesive to an oscillation unit is mitigated by restricting the direction in which the adhesive spreads along the rear surface of the piezoelectric oscillation piece, and the CI value of the piezoelectric oscillation piece is prevented from worsening. A piezoelectric device package (10) has a main package body (10a) for holding the piezoelectric oscillation piece (50), and connective electrodes (23, 24) which are electrically connected to excitation electrodes (53, 54) formed on the piezoelectric oscillation piece (50) are provided in the main package body (10a). The connective electrodes (23, 24) are provided with cutouts (25, 26) formed in the oscillation part (51) side of the piezoelectric oscillation piece (50) held in the main package body (10a).
申请公布号 WO2015115388(A1) 申请公布日期 2015.08.06
申请号 WO2015JP52094 申请日期 2015.01.27
申请人 NIHON DEMPA KOGYO CO.,LTD. 发明人 ASAMIZU TAKASHI
分类号 H01L23/12;H01L23/08;H03B5/32;H03H9/02;H03H9/10 主分类号 H01L23/12
代理机构 代理人
主权项
地址