发明名称 |
POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED OBJECT OBTAINED THEREFROM |
摘要 |
<p>Positive photosensitive insulating resin compositions of the invention contain at least (A) an alkali soluble resin having a phenolic hydroxyl group, (B) a compound having a quinonediazido group, (C) crosslinked fine particles, (D) a compound containing at least two alkyletherified amino groups in the molecule, and (F) a solvent. The resin compositions have excellent resolution, electrical insulating properties and thermal shock properties. Cured products of the invention are obtained by curing these resin compositions, and they show good adhesive properties. <IMAGE></p> |
申请公布号 |
EP1469346(B1) |
申请公布日期 |
2015.08.05 |
申请号 |
EP20030700565 |
申请日期 |
2003.01.15 |
申请人 |
JSR CORPORATION |
发明人 |
INOMATA, KATSUMI;NISHIOKA, TAKASHI;ITOU, ATSUSHI;SUZUKI, MASAYOSHI;IWANAGA, SHIN-ICHIROU |
分类号 |
G03F7/022;G03F7/004;G03F7/023 |
主分类号 |
G03F7/022 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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