| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To acquire external information for a high-precision electronic component to be mounted using image data taken by image pickup. <P>SOLUTION: An electronic component mounting device comprises: imaging means 1 for imaging the electronic component arranged in a component arrangement part; a movable part 111 for movably adjusting the distance between the component arrangement part and the imaging means; an imaging control part 120 that acquires a plurality of image data where the distance between the component arrangement part and the imaging means differs in electronic components by controlling these; a distance measuring processing part 23 that calculates a focusing position of the component arrangement part from the imaging means of each of the respective pixels based on a contrast in the same pixel of each image data; and an omnifocal image generation part 25 that calculates a luminance value in the focusing position of a pixel within a range of a part of an imaging area from the focusing position of each pixel in the imaging area and the luminance value of each pixel in each image data and generates a local omnifocal image. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
