发明名称 半導体装置
摘要 <p>A semiconductor device includes a semiconductor layer having a plurality of active regions that are separated by element isolation grooves, a capacitive film having a sidewall covering portion covering a sidewall of the element isolation grooves, and an electrode film laminated on the capacitive film, and a capacitor element is formed by the semiconductor layer, the capacitive film and the electrode film.</p>
申请公布号 JP5758729(B2) 申请公布日期 2015.08.05
申请号 JP20110164716 申请日期 2011.07.27
申请人 发明人
分类号 H01L21/8242;H01L27/108 主分类号 H01L21/8242
代理机构 代理人
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