| 摘要 |
The invention relates to a semiconductor package and a carrier (10) for a semiconductor package (100), having a top surface (12) and a bottom surface (14) separated by side walls (16), comprising a seat (20) for a component (50) and at least one terminal region (24, 26) for electrically connecting the component (50) to the carrier (10) when mounted to the seat (20), wherein a test portal (30) is arranged at an outer surface of the carrier (10), and wherein one or more routing paths (38) are arranged in the carrier (10) for routing one or more electrical contacts arranged at the carrier (10) to the test portal (30). |
