| 摘要 |
The present invention relates to a cured product and a use thereof. The cured product has excellent processability, workability, and adhesive properties, etc, and does not cause white turbidity, stickiness on the surface, etc. The cured product has excellent transparency, moisture resistance, mechanical properties, and crack resistance. The cured product, for example, is applied as an encapsulment or an adhesive material of a semiconductor device, thereby providing a device having long-term reliability. |
