| 摘要 |
An attachment method including an overlapping step of overlapping a support plate over a substrate under a reduced pressure environment; a temporary fixing step of temporarily fixing the support plate to the substrate; and an attaching step of attaching the support plate to the substrate under a reduced pressure environment. The method further includes, prior to the overlapping step, at least one of a first heating step in which heating is performed under an atmospheric pressure environment and a second heating step in which heating is performed under a reduced pressure environment. |
