发明名称 扁平銅粒子
摘要 <p><P>PROBLEM TO BE SOLVED: To provide flat copper particles having a high filling density of particles, and enabling easy control of viscosity when being changed into paste. <P>SOLUTION: This flat copper particle has a contour defined by a plurality of approximately linear sides in a plan view, comprises a flat body in which each angle formed by adjacent sides is≥60°and <180°, and has an average particle size of 0.05-0.5μm. The flat copper particles are produced preferably by a method including the first reduction process and the second reduction process performed thereafter. In the first reduction process, reducing sugar or hydrazine is used as a reducing agent, and in the second reduction process, two or more kinds of reducing agents whose hydrogen reduction standard potential E<SP POS="POST">0</SP>is -1.11 to -1.24 V are used as the reducing agent. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5759688(B2) 申请公布日期 2015.08.05
申请号 JP20100182494 申请日期 2010.08.17
申请人 发明人
分类号 B22F1/00;B22F9/24;C22C9/00 主分类号 B22F1/00
代理机构 代理人
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