| 摘要 |
A method is provided according to an example embodiment of the present invention for providing a porous cover structure for a mobile device for use with integrated audio components. Sound inlets and/or outlets in a mobile device cover may be replaced by one or more areas of microholes which are small enough to be invisible or almost invisible to the naked eye. The porous region may be located and dimensioned in a way that provides the best compromise between industrial design, mechanics, and audio requirements. Further, the audio component mechanics beneath the cover may be modified to take additional advantage of the porous cover structure, and the porous structure may also be used as an improved dust and liquid protection feature. A corresponding housing component and apparatus are also provided. |
