发明名称 インクジェット用光硬化性熱硬化性組成物及びこれを用いたプリント配線板
摘要 PROBLEM TO BE SOLVED: To provide a photocurable/thermosetting composition that includes titanium oxide and is suitable for drawing a pattern by using an inkjet printer on resin insulation layers, such as a solder resist, formed on a printed wiring board.SOLUTION: A photocurable/thermosetting inkjet composition comprises: a monomer having a (meth)acryloyl group and a glycidyl group in a molecule thereof, and having a viscosity of 10 mPa_s or less at 25°C; a trifunctional or higher acrylate monomer; titanium oxide; a heat-curing catalyst; and a photopolymerization initiator. The ink composition is used to draw the pattern on a resin insulation layer formed on the printed wiring board.
申请公布号 JP5758172(B2) 申请公布日期 2015.08.05
申请号 JP20110078845 申请日期 2011.03.31
申请人 太陽ホールディングス株式会社 发明人 志村 優之;依田 健志;宇敷 滋
分类号 C09D11/30;B41M5/00;C08F2/44;C09D11/00;C09D11/322;C09D11/38;H05K3/28 主分类号 C09D11/30
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