THE SOLDER BUMP STRUCTURE AND METHOD OF FABRICATING THE SAME

摘要

The present invention relates to a method for fabricating a solder bump and a solder bump structure thereof. The method comprises the steps of: preparing a device formed with a conductive pad; forming an insulating layer on at least parts of the upper conductive pad and the device; forming insulating layer patterns comprising cavities which expose the conductive pad by etching the insulating layer; forming a solder layer on a front surface of the conductive pad and insulating layer patterns; forming a solder bump in the solder layer, wherein the solder bump directly touches the conductive pad surrounded by the insulating layer patterns, by a dewetting treatment using plasma; and removing the insulating layer patterns.