Power semiconductor module with a substrate and a pressure device

摘要

The power semiconductor module has housing (9), a printing device (4), loads (50,52,54) and a substrate (1) with semiconductor components (3a,3b). The auxiliary connecting elements (6,60,62) lead to the outside, where the substrate has an insulating body (10). The main surface of the insulating body faces the inner side of the power semiconductor module, where the conducting paths (2a,2b) have load and auxiliary potentials. The main surface has two recesses (7a,7b,7c,7d) on two areas that are not covered by the power semiconductor components in the area of the arranged conducting paths.