| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an MMIC package with improved high frequency properties by suppressing an inductance component to establish a connection between a high frequency component of a large chip size and a package terminal. <P>SOLUTION: An MMIC package 1 includes: a conductor base plate 200; an MMIC substrate 24 which is disposed on the conductor base plate 200, and has an input terminal 24a and an output terminal 24b; a ceramic frame body 180 which is disposed on the conductor base plate 200, and surrounds the MMIC substrate 24; a package input terminal 21a and a package output terminal 21b which are disposed on the ceramic frame body 180; a bonding substrate 25 disposed on the conductor base plate 200 located between the MMIC substrate 24 and the ceramic frame body 180; a capacitor electrode 25a disposed on the bonding substrate 25; and first and second bonding wires 12 and 14 which establish a connection between the package input terminal 21a and the capacitor electrode 25a, and a connection between the capacitor electrode 25a and the input terminal 24a, respectively. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
