发明名称 |
METHOD FOR DICING A SUBSTRATE WITH BACK METAL |
摘要 |
The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the first surface. A mask layer is provided on the first surface of the substrate and a thin film layer is provided on the second surface of the substrate. The first surface of the substrate is diced through the mask layer to expose the thin film layer on the second surface of the substrate. A fluid from a fluid jet is applied to the thin film layer on the second surface of the substrate after the thin film layer has been exposed by the dicing step. |
申请公布号 |
EP2901476(A1) |
申请公布日期 |
2015.08.05 |
申请号 |
EP20130771748 |
申请日期 |
2013.09.25 |
申请人 |
PLASMA-THERM, LLC |
发明人 |
FALVO, PETER;MARTINEZ, LINNELL;PAYS-VOLARD, DAVID;GAULDIN, RICH;WESTERMAN, RUSSELL |
分类号 |
H01L21/78;B28D5/00;H01L31/18;H01L33/00 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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