| 摘要 |
<p>Provided is a chip inductor which includes: a dielectric body which is formed by stacking dielectric layers therein, and includes a lower side provided on a mounting surface and an upper side corresponding to the same, both sides in a lengthwise direction and both sides in a widthwise direction; a plurality of conductor patterns which are formed on the magnetic body layer, and are connected to have a coil structure; and a pair of first and second electrodes, which are formed on each of both sides of the dielectric body, which face each other. The reliability for the directivity of the chip inductor mounted on the substrate can be improved.</p> |
