发明名称 Silicon carbide semiconductor device with a gate electrode
摘要 <p>According to one embodiment, a semiconductor device, having a semiconductor substrate comprising silicon carbide with a gate electrode disposed on a portion of the substrate on a first surface with, a drain electrode disposed on a second surface of the substrate. There is a dielectric layer disposed on the gate electrode and a remedial layer disposed about the dielectric layer, wherein the remedial layer is configured to mitigate negative bias temperature instability maintaining a change in threshold voltage of less than about 1 volt. A source electrode is disposed on the remedial layer, wherein the source electrode is electrically coupled to a contact region of the semiconductor substrate.</p>
申请公布号 GB2503830(B) 申请公布日期 2015.08.05
申请号 GB20130017295 申请日期 2012.03.28
申请人 GENERAL ELECTRIC COMPANY 发明人 STEPHEN DALEY ARTHUR;TAMMY LYNN JOHNSON;JOSEPH DARRYL MICHAEL;JODY ALAN FRONHEISER;DAVID ALAN LILIENFELD;KEVIN SEAN MATOCHA;WILLIAM GREGG HAWKINS
分类号 H01L29/45;H01L29/49 主分类号 H01L29/45
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