发明名称 集積回路デバイス
摘要 A semiconductor chip includes four linear-shaped conductive structures that each form a gate electrode of corresponding transistor of a first transistor type and a gate electrode of a corresponding transistor of a second transistor type. First and second ones of the four linear-shaped conductive structures are positioned to have their lengthwise-oriented centerlines separated by a gate electrode pitch. Third and fourth ones of the four linear-shaped conductive structures are also positioned to have their lengthwise-oriented centerlines separated by the gate electrode pitch. The first and third ones of the four linear-shaped conductive structures are positioned to have their lengthwise-oriented centerlines co-aligned and are separated by a first end-to-end spacing. The second and fourth ones of the four linear-shaped conductive structures are positioned to have their lengthwise-oriented centerlines co-aligned and are separated by a second end-to-end spacing substantially equal in size to the first end-to-end spacing.
申请公布号 JP5758815(B2) 申请公布日期 2015.08.05
申请号 JP20120015484 申请日期 2012.01.27
申请人 テラ イノヴェイションズ インク 发明人 ベッカー、スコット、ティー.;スメイリング、マイケル、シー.
分类号 H01L21/82 主分类号 H01L21/82
代理机构 代理人
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