摘要 |
Provided is a thermoelectric module, including: a first substrate (110a) and a second substrate (110b) disposed to face each other; at least one unit thermoelectric element composed of a pair of semiconductor elements (120) including a P-type semiconductor element (122 ; 124) and an N-type semiconductor element (122 ; 124) disposed in an internal area between the first substrate (110a) and the second substrate (110b) disposed to face each other and having respective ends electrically connected to each other via electrodes; and at least two kinds of sealing parts (132 ; 134) having different thermal conductivities and coated on at least one area of the internal area between the first substrate (110a) and the second substrate (110b) disposed to face each other. |