| 发明名称 |
Bi-Sn-BASED HIGH-TEMPERATURE SOLDER ALLOY |
| 摘要 |
A high-temperature solder alloy is a Bi-Sn based solder alloy containing at least 90 mass % of Bi, further containing 1 - 5 mass % of Sn, at least one element selected from Sb and/or Ag each in an amount of 0.5 - 5 mass %, and preferably further containing 0.0004 - 0.01 mass % of P. |
| 申请公布号 |
EP2589459(A4) |
申请公布日期 |
2015.08.05 |
| 申请号 |
EP20110800638 |
申请日期 |
2011.06.17 |
| 申请人 |
SENJU METAL INDUSTRY CO., LTD |
发明人 |
UESHIMA MINORU;INAGAWA YOSHIMI;TOYODA MINORU |
| 分类号 |
B23K35/26;B23K1/00;B23K101/40;C22C12/00;H05K3/34 |
主分类号 |
B23K35/26 |
| 代理机构 |
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