| 摘要 |
The present invention relates to a thermosetting composition and a cured film obtained by using the same, the composition comprising: a low molecular epoxy compound (A) comprising at least three epoxy groups, with the weight average molecular weight of less than 5000; a high molecular epoxy compound (B) comprising at least three epoxy groups, with the weight average molecular weight of more than or equal to 30000; and a carboxylic compound (C) comprising at least three carboxylic groups. A cured film with excellent both properties of flatness and compliance of foreign substances can be obtained by using the thermosetting composition of the present invention. |
