发明名称 積層素子における信号送出
摘要 Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.
申请公布号 JP5758296(B2) 申请公布日期 2015.08.05
申请号 JP20110526974 申请日期 2009.09.10
申请人 发明人
分类号 H01L25/065;H01L25/07;H01L25/18 主分类号 H01L25/065
代理机构 代理人
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