The present invention relates to a printed circuit substrate including a substrate and a hole of which the width formed on the inner side of the substrate is wider than the width formed on one side or the other side of the substrate. Therefore, the present invention can form a hole which is able to penetrate the substrate even when the eccentricity of the hole partially occurs.
申请公布号
KR20150089563(A)
申请公布日期
2015.08.05
申请号
KR20140010328
申请日期
2014.01.28
申请人
LG INNOTEK CO., LTD.
发明人
AN, HEE BEOM;PARK, JEONG WON;KANG, KYU DONG;PARK, GYU HO;PARK, SU JIN;YOON, SANG HOON