发明名称 PRINTED CIRCUIT SUBSTRATE
摘要 The present invention relates to a printed circuit substrate including a substrate and a hole of which the width formed on the inner side of the substrate is wider than the width formed on one side or the other side of the substrate. Therefore, the present invention can form a hole which is able to penetrate the substrate even when the eccentricity of the hole partially occurs.
申请公布号 KR20150089563(A) 申请公布日期 2015.08.05
申请号 KR20140010328 申请日期 2014.01.28
申请人 LG INNOTEK CO., LTD. 发明人 AN, HEE BEOM;PARK, JEONG WON;KANG, KYU DONG;PARK, GYU HO;PARK, SU JIN;YOON, SANG HOON
分类号 H05K1/02;H05K1/03 主分类号 H05K1/02
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