STRUCTURE AND APPROACH TO PREVENT THIN WAFER CRACK

摘要

Provided are a semiconductor structure and a manufacturing method. A device such as an integrated circuit die is mounted on a substrate same to such as another die, a packaging substrate, and an interposer, and a recess is formed on the substrate along a scribe line. One or more molding compound layers are formed on the recess and between adjacent dies. A back surface slimming process is performed to expose a molding compound in the recess. An individualization process is performed on the molding compound layer in the recess. In an embodiment, the first molding compound is formed on the recess, and a second molding compound is formed on the first molding compound layer and between the adjacent dies. The device can be arranged on the substrate before or after forming the recess.