| 摘要 |
Apparatus 1' for forming a busbar having a width of less than 25mm and a thickness of less than 120microns, the apparatus 1' comprising means to continuously supply a length of substrate having a pair of major surfaces, a width of less than 25mm and a thickness of less than 120microns, means 3' to clean the substrate, a hot dip overlayer application means 5' comprising a bath 50' for overlayer material OL to apply, in use, an overlayer material OL to all of the surfaces of the substrate S, overlayer control means (51', 60') to control the amount of overlayer material OL adhered to the substrate S, the overlayer control means (51', 60') comprising wiping means 51' to physically contact both major surfaces of the substrate S, wherein the wiping means 51' are located, in use, beneath the surface level of overlayer material OL retained in the bath 50'. |
