发明名称 |
SEMICONDUCTOR PACKAGE SUBSTRATE, PACKAGE SYSTEM USING THE SAME AND METHOD FOR MANUFACTURING THEREOF |
摘要 |
A semiconductor package substrate includes an insulating substrate, a circuit pattern on the insulating substrate, a protective layer formed on the insulating substrate to cover the circuit pattern on the insulating substrate, a pad formed on the protective layer while protruding from a surface of the protective layer, and an adhesive member on the pad. |
申请公布号 |
EP2856502(A4) |
申请公布日期 |
2015.08.05 |
申请号 |
EP20130793826 |
申请日期 |
2013.05.24 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
RYU, SUNG WUK;KIM, DONG SUN;SHIN, SEUNG YUL |
分类号 |
H01L23/12;H01L23/15 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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