Electrical assembly with a solder sphere attached heat spreader

摘要

An electrical assembly (10) that includes a circuit board (12), an electrical device (14), a heat spreader (26), and a solder sphere (36). The electrical device (14) is a surface mount type package attached to the circuit board (12). The heat spreader (26) overlies and extends beyond the outline (28) of the device (14), and is in thermal contact the top side of the surface mount type package. A contact surface (30) of the heat spreader (26) is spaced apart from a mounting surface (18) of the circuit board (12) by a distance (32) based on a height (34) of the top side above the mounting surface (18). The solder sphere (36) has a pre-reflow diameter sufficient to couple the contact surface (30) to the mounting surface (18) after the solder sphere (36) is reflowed.