| 摘要 |
<p>A die bonding apparatus comprises: a stage wherein dies supporting a substrate to be bonded; a bonding head conveying the dies to be bonded to the substrate and capable of controlling horizontality; a copy stage disposed on one side of the stage and copying and maintaining the horizontality of the bonding head; a sensor respectively measuring the horizontality of the stage and the copy stage; and a control unit controlling the horizontality of the bonding head to have the same horizontality with the stage in accordance with a measurement result of the sensor. Therefore, the horizontality of the stage and the bonding head are corresponded to prevent a bonding defect.</p> |
