| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce occurrence of erroneous determination in solder appearance inspection after a semiconductor device is mounted. <P>SOLUTION: The method of manufacturing a semiconductor device includes a step of forming a step surface (half-punching region 25) oriented to a tip end side of a lead 20 on a mounting surface side of the lead 20 by half-punching the lead 20 of the semiconductor device 100 from the mounting surface side of the semiconductor device 100 toward an opposite surface thereof. The manufacturing method further includes steps of: forming a plating film 30 that covers the lead 20; and removing a portion on a tip end side beyond the step surface of the lead 20 by cutting the lead 20 along the extension surface of the step surface. The manufacturing method further includes a step of rolling out the plating film 30 on the surface opposite to the mounting surface of the lead 20 toward the tip end surface side of the lead 20. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
