| 摘要 |
<p>A method of fabricating a neurostimulation circuit is disclosed. According to the present invention, individual implantable assembly layers are cut by a laser or by mechanical means, and then stacked together, thereby providing a more efficient manufacturing method for manufacturing high density implantable electrode arrays and cables. In the invention, the separate implantable assembly layers can be melted and conglomerated to form a neurostimulation circuit in which the conductors and terminal pads are encapsulated within a continuous polymer insulating film.</p> |
