MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE THEREOF

摘要

In the present invention, disclosed are a method for manufacturing a semiconductor device and the semiconductor device manufactured thereby, capable of minimizing manufacturing costs and the waste of a material, and increasing a production yield by differentially manufacturing a product unit of a substrate and a product unit of an interposer to correspond to each other. According to one embodiment of the present invention, disclosed is the method for manufacturing the semiconductor device which includes a substrate preparing step of preparing the substrate which includes a conductive pillar on the outside of a semiconductor die and forms a unit by the connection of the semiconductor die; a mold and interposer connection step of molding the conductive pillar and the semiconductor die of the substrate and electrically connecting the conductive pillar and the interposer; a solder ball connection step of connecting a solder ball on the substrate; and a sawing step of dividing the semiconductor dies into one semiconductor device, respectively, by sawing the substrate.