CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a chip electronic component and a manufacturing method thereof. More particularly, the present invention relates to a chip electronic component which increases a loss factor due to a leakage current by forming insulating layers formed in the outside of an internal coil and the insulating layers with different widths in a core part, and prevents the deterioration of inductor capacity, and a manufacturing method thereof.