Communication terminal device and manufacturing method thereof

摘要

A communication terminal device includes a printed wiring board disposed in a casing, a feed pattern provided on a main surface of the printed wiring board, a radiation plate including a substantially planar radiation portion substantially perpendicular to the main surface of the printed wiring board and a lead portion connecting the radiation portion to the feed pattern, and a component mounted on the main surface of the printed wiring board to overlap the lead portion when the main surface of the printed wiring board is viewed from above, the component including a conductive material, a magnetic material and/or a dielectric material. The radiation portion is connected to the lead portion at a side spaced away from the main surface of the printed wiring board, and an area of the lead portion is located at a predetermined distance from the main surface of the printed wiring board.

主权项

1. A communication terminal device comprising:
a printed wiring board disposed in a casing; a feed pattern provided on a main surface of the printed wiring board; a radiation plate including a planar radiation portion arranged perpendicular or substantially perpendicular to the main surface of the printed wiring board and a lead portion that connects the radiation portion to the feed pattern; and a component mounted on a main surface of the printed wiring board in an area that overlaps the lead portion when the main surface of the printed wiring board is viewed in a top-bottom direction, the component including at least one of a conductive material, a magnetic material and a dielectric material; wherein the radiation portion is connected to the lead portion at an upper portion of the radiation portion spaced away from the printed wiring board by a greater distance than a distance from the printed wiring board to a lower portion of the radiation portion opposite to the upper portion in the top-bottom direction; and the lead portion, in the area overlapping the component when the main surface of the printed wiring board is viewed in the top-bottom direction, is located at a predetermined distance from the main surface of the printed wiring board.