Light emitter packages and devices having improved wire bonding and related methods

摘要

Light emitter packages and devices having improved wire bonding and related methods are disclosed. In one embodiment a light emitter package can include at least one light emitting diode (LED) chip electrically connected to an electrical element via a wire bond. The wire bond can be provided at improved wire bonding parameters such as a temperature of approximately 150° C. or less, a bonding time of approximately 100 ms or less, a power of approximately 1700 mW or less, and a force of approximately 100 grams force (gf) or less, or combinations thereof.

主权项

1. A method of providing a light emitter package, the method comprising:
providing at least one light emitting diode (LED) chip; providing an electrical element; and wire bonding the at least one LED chip to the electrical element at a temperature of approximately 150° C. or less; and wherein wire bonding the LED chip to the electrical element further comprises at least one of: wire bonding at a force of approximately 100 grams force (gf) or less; wire bonding at a power of approximately 1700 mW or less; or wire bonding at a time of approximately 100 milliseconds (ms) or less.