Conductor with a plurality of vertical extensions for a 3D device

摘要

Conductors in a 3D circuit that include horizontal lines with a plurality of vertical extensions in high aspect ratio trenches can be formed using a two-step etching procedure. The procedure can comprise providing a substrate having a plurality of spaced-apart stacks; forming a pattern of vertical pillars in a body of conductor material between stacks; and forming a pattern of horizontal lines in the body of conductor material over stacks, the horizontal lines connecting vertical pillars in the pattern of vertical pillars. The body of conductor material can be deposited over the plurality of spaced-apart stacks. A first etch process can be used to form the pattern of vertical pillars. A second etch process can be used to form the pattern of horizontal lines. The conductors can be used as word lines or as bit lines in 3D memory.

主权项

1. A method of forming conductors in a 3D circuit, comprising:
providing a substrate having a plurality of spaced-apart stacks; forming a body of conductor material by depositing a conductor material over the plurality of spaced-apart stacks; etching the body of conductor material to form a pattern of vertical holes between the spaced-apart stacks in the body of conductor material and forming a pattern of vertical pillars between stacks in the plurality of spaced-apart stacks; and etching the body of conductor material to form trenches over the spaced-apart stacks, the trenches aligned to connect vertical holes in the pattern of vertical holes, and forming a pattern of horizontal lines in the body of conductor material over stacks in the plurality of spaced-apart stacks, the horizontal lines connecting vertical pillars in the pattern of vertical pillars.