Article including a device wafer reversibly mountable to a carrier substrate

摘要

New temporary bonding methods and articles formed from those methods are provided. The methods comprise bonding a device wafer to a carrier wafer or substrate only at their outer perimeters in order to assist in protecting the device wafer and its device sites during subsequent processing and handling. The edge bonds formed by this method are chemically and thermally resistant, but can also be softened, dissolved, or mechanically disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process.

主权项

1. An article comprising:
a first substrate having front and back surfaces, said front surface having a peripheral region and a central region, wherein said first substrate comprises a device wafer having a device surface comprising an array of devices selected from the group consisting of integrated circuits; MEMS; microsensors; power semiconductors; light-emitting diodes; photonic circuits; interposers; embedded passive devices; and microdevices fabricated on or from a material selected from the group consisting of silicon, silicon-germanium, gallium arsenide, and gallium nitride; an edge bond presenting first and second surfaces, said first surface being bonded to said peripheral region and said second surface being remote from said peripheral region, said edge bond being absent from said central region so as to form a fill zone, said edge bond being formed from a material comprising monomers, oligomers, or polymers selected from the group consisting of epoxies, acrylics, silicones, styrenics, vinyl halides, vinyl esters, polyamides, polyimides, polysulfones, polyethersulfones, cyclic olefins, polyolefin rubbers, and polyurethanes, wherein the integrity of said edge bond is maintained upon being submerged in concentrated sulfuric acid at room temperature for 10 minutes or in 30% by weight potassium hydroxide solution at about 85° C. for about 45 minutes; and an amorphous polymeric fill material in said fill zone, said material having an adhesion strength of less than about 50 psig and being absent from said first and second surfaces, wherein the adhesion strength is determined by ASTM D4541/D7234, wherein said edge bond has an adhesion strength that is at least about 0.5 psig greater than said fill material adhesion strength.