Electronic device for power applications

摘要

An electronic device for power applications and configured for being mounted on a printed circuit board is disclosed. The electronic device includes a semiconductor chip integrating a power component, and a package. The package comprises an insulating body embedding the semiconductor chip, and exposed electrodes for electrically connecting conductive terminals of the semiconductor chip to external circuitry in the printed circuit board. The electronic device is further configured to be fastened to a heatsink with a back surface of the insulating body in contact with a main surface of the heatsink for removing heat produced by the electronic device during the operation thereof. The insulating body lacks of a fixing portion in which a hole for receiving an insertable fastener element for the fastening of the electronic device to the heatsink is located.

主权项

1. An electronic device for power applications configured to be mounted on a printed circuit board and fastened to a heatsink having a main surface, the electronic device comprising:
a semiconductor chip integrating a power component and including conductive terminals; and a package that includes:
an insulating body embedding the semiconductor chip and including a back surface configured to contact the main surface of the heat sink,exposed electrodes for electrically connecting the conductive terminals of the semiconductor chip to external circuitry on the printed circuit board; andan elastic fastener element configured to be placed astride a corresponding portion of the main section of the insulating body and configured to fasten the electronic device to the heat sink, the elastic fastener element having a main segment with first and second ends, a first arm segment extending from the first end of the main section and a second arm segment extending from the second end of the main section, the first arm segment being configured to engage with a first slit of the heat sink and the second arm segment being configured to engage with a second slit of the heat sink.