发明名称 Two-stage power delivery architecture
摘要 A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage regulator. The two-stage power delivery network also includes a semiconductor die supported by the packaging substrate. The two-stage power delivery network also includes a capacitor that is supported by the packaging substrate. The capacitor is operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator.
申请公布号 US9101068(B2) 申请公布日期 2015.08.04
申请号 US201313830033 申请日期 2013.03.14
申请人 QUALCOMM INCORPORATED 发明人 Yun Changhan;Carobolante Francesco;Zuo Chengjie;Kim Jonghae;Velez Mario Francisco;Smith Lawrence D.;Nowak Matthew M.
分类号 H05K7/00;H05K7/10;H05K1/02;H05K1/16;H01L23/498 主分类号 H05K7/00
代理机构 Seyfarth Shaw LLP 代理人 Seyfarth Shaw LLP
主权项 1. A two-stage power delivery network, comprising: a voltage regulator; an interposer comprising a packaging substrate having an embedded inductor including a plurality of traces and a plurality of through substrate vias at opposing ends of the plurality of traces, the interposer coupled to the voltage regulator; a semiconductor die supported by the packaging substrate; and a metal-insulator-metal capacitor directly on the packaging substrate and embedded within a protective layer of the interposer, the metal-insulator-metal capacitor operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator.
地址 San Diego CA US