发明名称 Method of manufacture of particles with controlled dimensions
摘要 A process for the preparation of particles with controlled dimensions comprising the steps of: (i) providing a laminar substrate having a patterned surface comprising a micro-relief repeat pattern comprising one or more discrete cells, each cell consisting of a floor portion and walls having a height (HW); (ii) depositing organic or inorganic material onto the patterned surface and into the cells to provide a thickness (T) of the deposited material wherein T≦HW (iii) stripping the deposited organic or inorganic material from the surface of the substrate; and (iv) collecting the particles formed from said organic or inorganic material; and a composition obtainable from said process comprising a plurality of particles (P), wherein the number (n) of particles in said composition is at least 10, wherein said particles (P) are platelets exhibiting a planar geometry which is circular or which is made up of a number (x) of planar (y)-sided polygon(s), wherein x is from 1 to 20 and y is at least 3 wherein if x is greater than 1 then said planar (y)-sided polygons are fused along one or more sides thereof, wherein the width (WP) of the platelets (P) at their widest point is no more than about 250 μm and the thickness of the platelets (P) is in the range of 10 nm to 50 nm.
申请公布号 US9095899(B2) 申请公布日期 2015.08.04
申请号 US200712283000 申请日期 2007.03.16
申请人 发明人 Szuscik-Machnicki Andrew Henry;Dawes Mark Edward
分类号 C04B14/04;B22F1/00;B22F9/02;C09C1/00 主分类号 C04B14/04
代理机构 Knobbe, Martens, Olson & Bear LLP 代理人 Knobbe, Martens, Olson & Bear LLP
主权项 1. A process for the preparation of particles with controlled shape comprising the steps of: (i) providing a laminar substrate having a patterned surface comprising a micro-relief repeat pattern comprising one or more discrete cells, each cell consisting of a floor portion and walls having a height (HW); (ii) depositing organic or inorganic material onto the patterned surface and into the cells to provide individual particles with a thickness (T) of the deposited material wherein T<HW; (iii) stripping the deposited organic or inorganic material from the surface of the substrate to release the individual particles of controlled shape; and (iv) collecting the particles formed from said organic or inorganic material.
地址 London GB