Multi-core dies produced by reticle set modification

摘要

A first reticle set designed for manufacturing dies with a limited number of cores is modified into a second reticle set suitable for manufacturing at least some dies with at least twice as many cores. The first reticle set defines scribe lines to separate the originally defined dies. At least one scribe line is removed from pairs of adjacent but originally distinctly defined dies. Inter-core communication wires are defined to connect the adjacent cores, which are configured to enable the adjacent cores to communicate during operation without connecting to any physical input/output landing pads of the resulting more numerously cored die, which will not carry signals through the inter-core communication wires off the P-core die. The inter-core communication wires may be used for power management coordination purposes or to bypass the external processor bus.

主权项

1. Multi-core dies produced by a process comprising:
developing a first reticle set usable to print Q-core dies, wherein the first reticle set defines scribe lines to separate the Q-core dies, wherein the scribe lines collectively define a seal ring to surround each Q-core die, wherein Q is at least 1; and modifying less than all of the reticles of the first reticle set to produce a second reticle set useable to print P-core dies, wherein said modifying comprises removing at least one defined scribe line of the first reticle set and defining inter-core communication wires to connect at least two adjacent cores that were previously separated by the at least one defined scribe line, wherein P is at least twice Q; printing the multi-core dies on a semiconductor wafer using the second reticle set; and cutting the multi-core dies on the semiconductor wafer along the remaining scribe lines.