Reconfigurable guide pin design for centering wafers having different sizes

摘要

An apparatus includes a robot arm, and a plurality of guide pins mounted on the robot arm. Each of the plurality of guide pins includes a plurality of wafer supports at different levels, with each of the plurality of wafer supports configured to support and center a wafer having a size different from wafers configured to be supported and centered by remaining ones of the plurality of wafer supports.

主权项

1. An apparatus comprising:
a robot arm; and a plurality of guide pins mounted on the robot arm, wherein each of the plurality of guide pins comprises a plurality of wafer supports at different levels, with each of the plurality of wafer supports configured to support and center a wafer having a size different from wafers configured to be supported and centered by remaining ones of the plurality of wafer supports, wherein each of the plurality of guide pins further comprises:
a first wafer supporting portion configured to support a first wafer, the first wafer supporting portion having a first top surface parallel to a major surface of the first wafer;a second wafer supporting portion configured to support a second wafer, the second wafer supporting portion having a second top surface parallel to a major surface of the second wafer and a bottom surface parallel to the second top surface, the bottom surface opposite the second top surface and facing the first top surface; anda slanted portion extending from the first wafer supporting portion to the second wafer supporting portion, the slanted portion being diagonal to the first top surface and the second top surface, the bottom surface of the second wafer supporting portion overhanging the slanted portion.