Method and apparatus of RFID tag contactless testing

摘要

A semiconductor wafer includes a plurality of dies. Each of the plurality of dies includes a radio frequency identification (RFID) tag circuit and a coil. The RFID tag circuit includes a tag core, an RF front-end circuit, an ID decoder, a comparator and conductive line for a unique ID. The RF front-end circuit is configured to receive electromagnetic signals through the coil in each of the plurality of dies and to convert the received electromagnetic signals into commands. The ID decoder is configured to receive the commands and to generate an expect ID. The comparator is configured to compare the unique ID with the expect ID to generate a comparison result. The comparison result is arranged to decide if the tag core is configured to receive commands.

主权项

1. A semiconductor wafer, comprising:
a plurality of dies, each of the plurality of dies including a radio frequency identification (RFID) tag circuit and a coil; and each RFID tag circuit further including a tag core, a first circuit, an ID decoder, a comparator and conductive line for a unique ID; wherein
the first circuit is configured to receive electromagnetic signals through a respective coil and to convert the received electromagnetic signals into a command;the ID decoder is configured to receive the commands and to generate an expect ID; andthe comparator is configured to compare the unique ID with the expect ID to generate a comparison result; andthe comparison result is used in deciding if the tag core is configured to receive the commands.