Motherboard module and electronic apparatus using the same

摘要

The disclosure provides a motherboard module, which includes a motherboard, a cover, a plurality of raised posts and a plurality of plates. The cover covers the motherboard thereon and a first space is formed by the cover and the motherboard. The raised posts are disposed in the first space. The plates are detachably assembled to the raised posts and connected between any two adjacent raised posts so as to partition the first space into a plurality of second spaces. The plates and the raised posts can restrict the heat generated by the heat sources at different limited areas, which is advantageous for the cooling air-flow to cool the heat sources and the motherboard module thereby has better cooling performance.

主权项

1. A motherboard module, comprising:
a motherboard, having a plurality of electronic components; a cover, having a plurality of openings to expose the electronic components out of the cover through the openings, wherein when the cover covers the motherboard thereon, a first space is formed between the cover and the motherboard, and the electronic components are installed onto the motherboard through the openings; a plurality of raised posts, disposed in the first space; and a plurality of plates, detachably assembled between the raised posts and partitioning the first space into a plurality of second spaces.