发明名称 Adjustable hinge stiffness
摘要 An assembly can include a first component; a second component that includes a socket; a processor and a memory accessible by the processor, the processor and memory being included in one or more of the first component and the second component; and an interconnection mechanism for pivotable interconnection of the first component and the second component about a pivot axis where the interconnection mechanism includes a hinge that defines the pivot axis, a prong pivotable about the pivot axis, a latch mechanism to latch the second component to the interconnection mechanism with the prong received by the socket of the second component, an actuator to unlatch the latch mechanism, and a lever to adjust the hinge to a high stiffness state to adjust the hinge to a low stiffness state. Various other apparatuses, systems, methods, etc., are also disclosed.
申请公布号 US9098246(B2) 申请公布日期 2015.08.04
申请号 US201213624312 申请日期 2012.09.21
申请人 Lenovo (Singapore) Pte. Ltd. 发明人 Zawacki Jennifer Greenwood;DeCaro Vincent James;Nicholson John Weldon;Perrin Steven Richard;Kelso Scott Edwards;Jefferies Nicole L.
分类号 G06K1/16;H05K5/00;G06F1/16 主分类号 G06K1/16
代理机构 代理人 Pangrle Brian J.
主权项 1. An assembly comprising: a first component; a second component that comprises a socket; a processor and a memory accessible by the processor, the processor and memory being included in one or more of the first component and the second component; and an interconnection mechanism for pivotable interconnection of the first component and the second component about a pivot axis wherein the interconnection mechanism comprises a hinge that defines the pivot axis,a prong pivotable about the pivot axis,a latch mechanism to latch the second component to the interconnection mechanism with the prong received by the socket of the second component,an actuator to unlatch the latch mechanism, anda lever to adjust the hinge to a high stiffness state for the second component latched to the interconnection mechanism and to adjust the hinge to a low stiffness state for the second component unlatched from the interconnection mechanism.
地址 Singapore SG