System and method for remote temperature sensing with routing resistance compensation

摘要

An integrated circuit die includes multiple temperature sensor units each for measuring the temperature of respective regions of a semiconductor substrate of the integrated circuit die. The temperature sensor units are each coupled to a multiplexer by respective groups of signal lines. The signal lines include resistance compensation areas for maintaining a particular ratio of resistances of the signal lines of each group.

主权项

1. An integrated circuit die comprising:
a controller including:
an analog-to-digital converter having an input;a bandgap voltage generator coupled to the input of the analog-to-digital converter and configured to provide a bandgap voltage to the analog-to-digital converter;a first input coupled to the bandgap voltage generator;a second input coupled to the bandgap voltage generator; a multiplexer coupled to the controller; a plurality of temperature sensor units; a plurality of groups of conductive signal lines, each group of conductive signal lines electrically connecting a respective one of the temperature sensor units to the multiplexer, each group of conductive signal lines including:
a respective first signal line;a respective second signal line; anda respective plurality of resistance compensation areas in which a length of the first signal line is extended with respect to a length of the second signal line, the multiplexer configured to selectively electrically couple a respective one of the groups of conductive signal lines to the first and second inputs of the controller.