Method for manufacturing three-dimensional integrated circuit

摘要

A method for manufacturing a three-dimensional integrated circuit. The method includes: 1) adding a non-metallic light-induced catalyst including an alcohol and/or an aldehyde to a thermoplastic carrier material, and molding the resulting mixture by an injection molding machine to form a structural component; 2) irradiating a surface of the structural component with a laser ray to form a line pattern thereon; 3) immersing the structural component in a metal ion solution at room temperature for between 5 and 7 minutes; 4) washing the structural component with distilled water, and immersing the structural component in an aqueous solution including a reducing agent for between 5 and 7 minutes to allow the surface of the structural component to form a metal core; and 5) performing electroless copper plating and medium-phosphorus electroless nickel plating on an area comprising the metal core to yield a conductor track.

主权项

1. A method for manufacturing a three-dimensional integrated circuit, the method comprising:
1) adding a non-metallic light-induced catalyst comprising an alcohol and/or an aldehyde to a thermoplastic carrier material to yield a mixture, and molding the mixture by an injection molding machine to form a structural component, the non-metallic light-induced catalyst accounting for between 5 and 10 wt. % of the mixture; 2) irradiating a surface of the structural component with a laser ray to form a line pattern thereon; 3) immersing the structural component in a metal ion solution at room temperature for between 5 and 7 minutes, the metal ion solution having a PH value of between 4 and 6 and comprising at least one metal ion; 4) washing the structural component by distilled water, and immersing the structural component in an aqueous solution comprising a reducing agent for between 5 and 7 minutes to allow the surface of the structural component to form a metal core; and 5) performing electroless copper plating on an area comprising the metal core to yield a first plating layer having a thickness of between 1 and 12 μm, and performing medium-phosphorus electroless nickel plating to yield a second plating layer having a thickness of between 2 and 3 μm.